Heat Sink Design

Thermal conductivity of the material should be as high as possible.

Heat sink design.

A heat sink transfers the thermal energy generated by an electronic assembly or component into a cooling medium. Analysis demonstrated that the design with heat pipes running above the components kept junction temperatures within 2 c of the original. Heat sinks are an important element in circuit design because they provide an efficient path for heat to be transferred into the ambient air and away from electronic devices eg. In this report both parts are considered separately.

In this article we ll walk you through the basics of heat sinks and heat sink design including the calculations involved in defining the proper heat sink for your application. Cad model of a heat sink. One with heat pipes that stopped at the edge of the components and the other with heat pipes that ran above the components. Based on this definition anything from a rectangular sheet of metal to a complex finned copper or aluminum extrusion can be used as a heat sink.

A heat sink also commonly spelled heatsink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium often air or a liquid coolant where it is dissipated away from the device thereby allowing regulation of the device s temperature. The general theory behind a heat sink is to increase the surface area of the heat producing device enabling a more efficient transfer of heat into the ambient environment. Heat sink design key considerations in heat sink design. The heat is transferred from a higher temperature region electronic component to a lower temperature region fluid medium by conduction.

Heat sink design goals may vary but in this report optimization of the vertical heat sink is the main objective. To efficiently move thermal energy away from a heat generating component the heat sink must have high thermal conductivity. In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules. Ats engineers used analytical modeling and cfd simulations to examine the thermal performance of two aluminum heat sink designs.

The variables ε is the surface emissivity of the heat sink. Bjts mosfets linear regulators etc. A heat sink is a part that conducts heat from a heat generating component to a larger surface area to dissipate the heat to the surroundings thus reducing the temperature of the component. Some of the more common construction materials for heat sinks are aluminum and copper.

Reference the blog post the importance of radiation in heat sink design for a detail review of the role radiation plays in heat sink performance. As the amount of power dissipation in the device increases the size of the heat sink must increase to allow more surface area to be exposed to the ambient. One of the most critical parameters of a heat sink is the material from which it is constructed. Heat sinks are used on a broad range of electronics ranging from cpus to motor drivers.

As with the natural convection heat sink calculations the radiation heat dissipation q r1 from the area a 1 is calculated using equation 9.